The infrared image demonstrate the cooling power of TCPoly heat conducting plastics. The image on the left is an electronic component embedded in standard plastic and on the right the same device embedded in TCPoly thermally conductive engineered plastics. Due to their high thermal conductivity, TCPoly materials are able to spread and dissipate heat away from the component, resulting in a ~30°C temperature drop. The image on the right illustrates the temperature of the same component embedded in TCPoly material.
This simple example illustrates how these materials can be used to replace plastics to improve electronics cooling. However, there are many more potential applications. TCPoly materials are light weight and corrosion resistant, enabling high performance heat exchangers that have high resistance to corrosion and fouling. The materials can be used for short run printing of molds for compression molding, epoxy curing, and casting that behave more like their metal counterparts and can dissipate heat.