TECHNOLOGY

HIGH THERMAL CONDUCTIVITY 3D PRINTING FILAMENTS

TCPoly has developed unique high thermal conductivity polymer formulations and high thermal conductivity 3D printing filaments (>5 W/m-K) for use with commercial FDM printers. The patent pending materials allow for rapid prototyping with thermally conductive plastics as well as parts production through farm 3D printing. We offer both electrically conducting and electrically insulating grades to cover a broad range of applications including polymer heat exchangers, battery packs, heat sinks, cold plates, and thermally conductive tooling. Please visit our shop or contact us at filament@tcpoly.com for more information regarding filament sales.

HEAT CONDUCTING PLASTICS

High thermal conductivity plastics can replace both metals and normal plastics to offer low cost high performance thermal solutions for electronics.

The infrared image demonstrate the cooling power of TCPoly heat conducting plastics. The image on the left is an electronic component embedded in standard plastic and on the right the same device embedded in TCPoly thermally conductive engineered plastics.  Due to their high thermal conductivity, TCPoly materials are able to spread and dissipate heat away from the component, resulting in a ~30°C temperature drop. The image on the right illustrates the temperature of the same component embedded in TCPoly material.

This simple example illustrates how these materials can be used to replace plastics to improve electronics cooling. However, there are many more potential applications. TCPoly materials are light weight and corrosion resistant, enabling high performance heat exchangers that have high resistance to corrosion and fouling. The materials can be used for short run printing of molds for compression molding, epoxy curing, and casting that behave more like their metal counterparts and can dissipate heat.

BEYOND MATERIALS

TCPoly has developed parts and printing technology to further enhance the capabilities of our materials. Our team of engineers uses state of the art modeling and design software to develop unique thermal solutions for your most challenging applications. 

COOLING POWER VS. THERMAL CONDUCTIVITY

Conducting plastics can match Aluminum

The plot demonstrates the impact of thermal conductivity on the cooling power of a heat sink under a natural convection cooling regime. With identical geometry, a TCPoly 3D printed plastic heat sink (6 W/m-K) can perform within 5°C of an Aluminum heat sink, despite significantly lower thermal conductivity. This is because heat removal under natural convection is often limited by convection as opposed to conduction.

For more information on how the cooling power of TCPoly plastics can be used in real applications, download our white papers on heat sinks and liquid cold plates below.

BEYOND THERMAL MANAGEMENT

The heat conduction of our filaments can be leveraged for other applications as well…

FASTER PRINTING WITH TCPOLY FILAMENT